In semiconductor production, precise alignment of the crystal structures plays a central role, especially in monocrystalline silicon. This is particularly important when sawing ingots with wire-sawing machines, in which large silicon rods are cut into wafer-thin slices. In this process, a wire coated with abrasive paste cuts through the material at high speed. We have developed a high-precision optical angle measurement system to make the process more efficient and avoid orientation defects.

Our camera-based solution is integrated directly into the wire-saw and checks the orientation of the saw frame to the machine axis with an accuracy of 0.01°. Seamlessly integrated into existing production lines, it improves efficiency, reduces waste and increases the reproducibility and quality of the entire manufacturing process.

Characteristics

•  Highly precise alignment of the wire frame to the machine axis and thus to the zero axis of the ingot for the subsequent sawing process

• Automatic optical detection of the angular position to an accuracy of 0.01
• Optional measured calibration device for regular checking and qualification of the measuring system
• Automatic documentation and transfer of the results to higher-level MES systems