Non-destructive testing with optical measurement and testing technology
Our quality assurance technologies not only provide high-resolution, real-time analysis, but also predictive maintenance solutions that identify potential defects in advance. With the help of state-of-the-art camera technology, potential flaws can be identified at an early stage. This not only minimizes downtime, but also improves product quality while increasing your production yield. In doing so, these preventive measures reduce maintenance costs and allow for optimal adaptation of production processes – a decisive competitive advantage in a dynamic market environment.
The foundation of chip production
Ingots SlicingWhen slicing ingots, large silicon crystals are cut into thin wafers, which serve as the basis for semiconductor production. We offer optical measurement systems for setting up the angular position of wire-sawing machines for ingots in the machine: using a fully autonomous mobile camera-based measurement system, we ensure precise alignment of the saw frame to the inserted ingot to within 0.01°.
Remove irregularities
Surface GrindingAfter slicing the wafers, surface grinding is a crucial step to eliminate damage and unevenness. With our AI vision software Neuralyze®, we evaluate the symmetry of the cross-section. We supply complete optical inspection systems with integrated coaxial lighting and the necessary inspection software for at-line and in-line inspections.
Ensure perfectly smooth surfaces
Polishing Wafer SurfacesChemical-mechanical polishing (CMP) ensures ultra-smooth surfaces, which are crucial for subsequent production steps. Together with our automation partners, we supply fully automatic systems for loading and unloading wafers into and out of polishing machines.
FOSB Quality Inspection
Automated packaging and quality inspection of FOSBsOur automation partners use inspection technology from senswork for the fully automated and controlled packaging of FOSBs (Front Opening Shipping Boxes). We ensure that all attachments are correctly mounted on an FOSB, that the wafers are correctly stored (cross-slot inspection) and that the automatically applied labels are correctly printed.
Maximum precision for chip handlers
Microchip Handling in Automated SystemsOur camera system precisely detects the position and orientation of chips that are picked from trays. The position and rotation of the chips are captured and transmitted to the control system, ensuring exact placement in the test sockets. The automatic detection works reliably for different chip formats, and the calibration of the camera system with the handling system is entirely automated.
Expansion of our global presence to ensure the highest quality in the semiconductor industry
Since 2024, senswork has had a subsidiary in Singapore, known as a global center for the semiconductor industry. With many years of experience, we offer specialized machine vision solutions for processes such as cutting ingots, surface grinding, wafer polishing, and chip packaging and assembly.
We help our customers around the world maintain the highest production standards with our quality assurance expertise and inspection and test solutions.
The senswork optical 2D metrology system ensures the correct feeding of microchips in the semiconductor industry. Discover the benefits.
Guaranteed quality of electronic assemblies: senswork checks pluggability, coding and labels in a fully automated production process.