ZFokus - high-resolution 3D inspection

Application examples for ZFokus

  • 3D inspection of plug-in modules
  • Planarity measurements of electronic components (connection pins, SMD modules...)
  • 3D inspection of micro injection molding components
  • Soldering joints inspection
  • In general: three-dimensional height inspection with high resolution in small visual fields
  • ...

Microscopically small - with great inspection accuracy

With the ZFokus camera developed by senswork, you can inspect components up to a size of 11.5 x 11.5 mm with a precision of up to 0.01mm in Z direction.

Advantages of ZFokus® - Complete 3D image

ZFokus® offers major advantages for the inspection of small and micro components in in-line and offline inspection. The measurement principle delivers a complete three-dimensional caption of the component geometry from one perspective. The process does not cause problems like triangulation-based shadings in the 3D point cloud or reflection artifacts at the edges of the components. The 3D data obtained allows a precise assessment of three-dimensional features like, co-planarity, height details, inclination of layers, volume etc. Furthermore, ZFokus® offers a very high lateral detail resolution in particular in small fields of vision of approx. 5µm per pixel. And what is also worth mentioning: our 3D and 2D analysis can be completed "in one go", as a result of the additional 2D focused image that is being captured of the component.

Technical details:

  • Max. scannable Z area: 20 mm / typically 1-5 mm
  • Z resolution max.: 10 µm
  • Field of vision lateral: 11.5 x 11.5 mm
  • Location resolution lateral: 5 µm
  • Scan time per inspection: depending on the Z resolution approx. 1-3 Sekunden
  • Camera resolution: 2048 x 2048 monochrome pixels (color optional)
  • System interface: USB 3.0
  • Software interface: ZFokus® API Cognex Designer Plug-In
  • Image data: 3D depth images (16 Bit), 2D focused image (8 Bit)

Ensure quality even in the smallest detail

with ZFokus® by senswork

ZFokus® is applied in clocked in-line processes or in offline inspections for the high-resolution 3D assessment of small and micro components. Traditional technologies like laser scanning and stripe light projections are, for numerous reasons, not applicable for the inspections. The main reasons are distracting artifacts at component edges, problems with overexposure and reflections at the components, as well as shading, which generally result from the triangulation principle.

The depth-from-focus method (DfF or even focus variations) proofs to be promising and superior to different procedures in many aspects. The ZFokus® system calculates the 3D image data by capturing several hundred images of the component from different distances in a very short time (usually 1-3 seconds). The system then creates a 3D elevation map of the component, based on the location-based focus data of the image.

The strengths of the system lie in the high-performant, parallel processing of a large amount of image data for every scan (several gigabyte per scan!) as well as the intelligent calculation of the Z data, which takes the reflection characteristics of the component into consideration. The use of fast and robust interpolation algorithms enables a calculation of elevation data in a practically unrivalled quality and precision.

The 3D data captured is very detailed and provides convincing quality, in particular in small fields of vision. Another major advantage of ZFokus®: in addition to the depth image, the camera captures an overlaid, focused 2D image, which can be used for additional 2D analysis, e.g. the distance measurement etc. of the component.

ZFokus® is applied in a variety of industries, while the objective of its development was the inspection of plug-in modules, electronic components or microinjection molding parts.

Inspection of plug-in units

The co-planarity inspection of SMD units or the pin-height inspection are two exemplary fields of application for ZFokus® solutions. By using the 3D elevation data, the contact surfaces can be measured in relation to the surrounding reference surfaces in Z direction. This ensures a clean plug-in in the following soldering process. The same applies to measuring of pin-heights, which only ensure a clean contact to the mating connector in the long-term, if the height of the pin plateau is within the specified drawing tolerance.

Precise small injection molding parts

The system also shows its strengths in the inspection of microinjection molding parts. The smallest details of the components are displayed precisely. Corresponding 3D inspection tools enable an identification of breaks, measuring of geometries or the definition of differences in height.

Soldering joints inspection

In the soldering joints inspection, the ZFokus® is able to define the soldering volume, detect gaps in the soldering joint and analyze the shape of a soldering joint. ZFokus® shows its strengths in the analysis of soldering joints, where 2D systems deliver either a high number of pseudo rejects as a result of unstable contrast variances, or are not able to detect error features in a process safe way.

Wear-free inspections - up to the smallest detail for maximum precision

The co-planarity inspection of SMD units or the pin-height inspection are two exemplary fields of application for ZFokus® solutions. By using the 3D elevation data, the contact surfaces can be measured in relation to the surrounding reference surfaces in Z direction.  This ensures a clean plug-in in the following soldering process. The same applies to measuring of pin-heights, which only ensure a clean contact to the mating connector in the long-term, if the height of the pin plateau is within the specified drawing tolerance.

As ZFokus® is based on a contact-free measurement, there are obvious advantages compared to the mechanical scanning processes in co-planarity inspections or pin-height inspections: the component is not mechanically influenced during the measurement, the process is wear-free and in addition to the maximum Z position of e.g. a contact surface, the angel location and/or the direction of the surface can also be defined.

Robust Design

The ZFokus® Controller makes sure to conduct the recording synchronous to the feed rate, the 3D data is then calculated with a standard but high-performance embedded PC in almost real-time to the image capturing sequence. During the design process of the ZFokus® we paid special attention to developing an industry-compatible, robust device to fulfill the requirements of industrial in-line measuring technology. A high-performance LED light is integrated into the system, which can be equipped with additional lights, if required and depending on the reflection characteristics of the component.

Guaranteed precision - with special calibration

Every ZFokus® system is calibrated and checked during a calibration process at senswork. A special calibration standard was developed to check and ensure the Z data determined within the working area of the system.

The current achievable resolution in Z direction is 10µm with a maximum field of vision of 11.5 x 11.5 mm. The scan time depends on different aspects and is usually 1-3 seconds. An update of the camera with larger fields of vision is currently in the planning phase.

 

Anwendungsbereiche

Inspektion von Pressfits an Steckerleisten

Ein Automobilzulieferer fertigt Steckerleisten für das Spezialgebiet „autonomes Fahren“. Diese Leisten müssen hochpräzise sein. Genau unser Ding!

Hochauflösende 3D-Inline-Inspektion

Hersteller von Steckerkomponenten werden mit stetig steigenden Anforderungen an die Präzision der Steckverbindungen und deren Kompaktheit konfrontiert, um den steigenden funktionellen Ansprüchen gerecht zu werden.

Lötstellen-Inspektion mit ZFokus

Bei der Lötstellen-Inspektion erlaubt ZFokus die Bestimmung des Lötvolumens, die Detektion von Lücken in der Lötstelle sowie die Bewertung der Form einer Lötstelle.

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